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TMI BlogSpecified Goods falling within one or more Chapters Imported for Manufacture of Specified Goods - G.E. No. 193BX X X X Extracts X X X X X X X X Extracts X X X X ..... ing conditions, namely :- (i) an officer not below the rank of a Joint Director in the Department of Electronics of the Government of India or a Joint Director in the Directorate of Industries of the Government of a State or an Additional Industrial Adviser in the Directorate General of Technical Development of Government of India, as the case may be, is satisfied that the goods in question are required for the purpose as specified in column (4) of the said Table and recommends grant of the above exemption : Provided that this condition shall not apply in the case of goods imported against supplementary import licences; (ii) the importer shall, by the execution of a bond in such form and for such sum as may be specified by the Assistant Collector of Customs, bind himself to pay, on demand, in respect of such goods as are not proved to the satisfaction of the Assistant Collector of Customs to have been used for the said purpose, an amount equal to the difference between the duty leviable on such imported goods but for the exemption contained herein and that already paid at the time of importation. TABLE S. No. Chapter of the First Sche dule to the Customs ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... c Capa citors. 18. 39, 69, 73 The following substances in any form with or without tags : (i) Phenolic/Polyamide/ SRBP (Synthetic Resin Bonded Paper) Substrates (ii) Enamelled steel substrates (iii) Glass epoxy unclad substrates (iv) Metal clad substrates (v) Ceramic/Alumina subs-trates Potentiometers, Hybrid microcircuits, Printed components, semicon ductor devices. 19. 71 Silver alloy strips in coils of width upto 0.434 inches and thickness upto 0.006 inches Relays, connectors, switches. 20. 39 (i) Synthetic polyelectrolyte dispersant (ii) Polyethylene adduct and non-ionic surface acting material (ZUSOPLAST) lubricant Ferrites. 21. 74 Electrolytic tough pitch (ETP) Copper wire and wire rods Lead wire for electronic components, resistors (other than heating resistors), potentiome-ters, capacitors. 22. 74 (i) Solder plated brass strips upto 100 mm width (ii) Silver plated brass strips upto 100 mm width Potentiometers, connec-tors, switches, relays. 23. 39 (i) (a) filled, Flame retardant moulding powder/ granules and with ̳ ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... r Aluminium Te-dlar (vi) Crane glass (vii) Tedlar coated alumin-ium sheet (viii) Phosphorous Oxychlo-ride (ix) Halo carbon (CF 4 )/ Freon gas (x) Tinned copper mesh inter connect (xi) Toughened glass with low iron content and transmissivity of mini mum 90% and above. Solar cells/modules. 32. 39, 71, 76, 78, 85 (i) Glue solvent resin in aliphatic alcohol (ii) Platinum Rhodium wire (iii) Aluminium wire with silicon or magnesium impurity of upto 2% (iv) Gold wire with phosphorous or antimony doping (v) Base solder (silver, lead, antimony based) (vi) Soft solder (lead, indium, silver based) (vii) Gold tin alloy (viii) Preforms, discs, dots, rings, wafers, plates, repartitors of the following materials : (a) Aluminium silicon (b) Gold boron (c) Molybdenum (d) Lead-tin solder (e) Silver antimony (f) Gold antimony (g) Silver Lead Indium (h) Silver Lead Antimony (i) Silver Lead Silicon Anti-mony (j) Solder (k) Lead Tin (l) Silver-Copper-Indium (m) Silver-Copper-Germani-um Arsenic (n) Berrylium Oxide Semiconductor devices. 33. 78 Lead foil Plastic film capacitors. ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... etardant) resin Deflection components, Capacitors. 49. 39 Emcol Witconate Magnetic tape. 50. 28, 31, 70, 74 (i) Suspension of Aluminium oxide in binder (ii) Suspension of Tungsten Powder and Aluminium oxide in binder (iii) Tungsten Rhenium Wire (iv) Triple Carbonate susp-ension of calcium, barium, strontium in binder Electron guns and electron gun parts. 51. 74, 85 OFHC Copper base with weldable steel ring Semiconductor devices. 52. 76 Plain Aluminium Foil containing more than 99% Aluminium Etched or Formed Alumi-nium Foil Electrolytic capacitors or plastic film capacitors. 53. 70, 85 Fused Quartzware Semiconductor Devices, Halogen Lamps or Silicon in all forms. 54. 81 Tantalum Powder Tantalum Capacitors. 55. 32, 70, 85 (i) Glass frit or Glass Powder (ii) Glass preforms or pellets (iii) Glass Tubes Liquid Crystal Displays, Semiconductor Devices, Electronic Valves and Tu bes, Glass to Metal Seals, Lead Frames, Transistor Headers, Reed Relays or Reed Switches, Delay Lines, Resistors (other than Heating Re ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... ls, Potentiometers, Connectors, Hybrid Mic rocircuits, Printed Com ponents, Electron guns and Electron gun parts, Coils and transformers. Electromagnetic shields, metallised ceramic rods, Encoders and synchros. 61. 81, 85 Tantalum, wrought, in all forms and articles thereof Solid Tantalum Capaci-tors, Electronic Valves and Tubes, Resistors (other than heating resistors). 62. 81, 85 Molybdenum and Moly bdenun alloys, wrought, in all forms and articles and parts thereof Electronic Valves and Tubes, X-Ray tubes, Semi conductor Devices, Resis tors and Resistive Arrays (other than Heating Resis tors), Mounted Piezo electric Crystals. 63. 81, 85 Tungsten and Tungsten alloys, wrought, in all forms and articles thereof Electronic Valves and tubes, Semiconductor De vices, Resistors and Resi stive arrays (other than Heating Resistors), Mou nted Piezoelectric Cry stals, Silicon in all forms, Metallised ceramic rods. 64. 39 Polyvinyl Alcohol Ferrites, Capacitors. 65. 39 Polyisobutylene Ferrites, Deflection com ponents. 66. 39, 40 Chlorosulphonated Polyethylene (H ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... aci-tors, DC micromotors upto 13.5 volts and not exceeding 20 watts rating. 79. 39 Polypropylene moulding powder/granules Plastic film capacitors, Deflection components, Cassettes, Loudspeakers, Microphones. 80. 39 Phenolic moulding pow der/resin with or without fillers Capacitors, potentiomet-ers, relays, switches, con nectors, Hybrid Micro circuits, printed compo nents, cones, spiders and dust caps for louds peakers, Resistors (other than heating resistors). 81. 39 Polybutyl terephthalate Connectors, deflection components, switches, relays. 82. 39 Special purity nitrocellulose based binding solution Semiconductor devices. 83. 39 Polysulphone moulding powder Deflection components. 84. 39, 40 (i) Polyphenelene sulphide (ii) Polyaryl sulphone Tape deck mechanisms, switches, connectors. 85. 39, 56 (i) Polyvinyl chloride film/ sheet (ii) Non-woven cloth or liner (iii) Polyester liner (iv) PVC glue Floppy disks/diskettes, Floppy disk jacket, Head cleaning diskette. 86. 28, 38, 39, 75, 80 (i) Gold pl ..... 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