TMI BlogElectronic industries raw materials and piece parts for specified end-uses in electronics industry [Chapter 85]X X X X Extracts X X X X X X X X Extracts X X X X ..... ns, namely :- (i) an officer not below the rank of a Joint Director in the Department of Electronics of the Government of India or a Joint Director in the Directorate of Industries of the Government of a State or a Director in the Department of Telecommunications of the Government of India or an Additional Industrial Adviser in the Directorate General of Technical Development of the Government of India, as the case may be, is satisfied that the goods in question are required for the purpose as specified in column (4) of the said Table and recommends grant of the above exemption : Provided that this condition shall not apply in the case of goods imported against supplementary import licences; (ii) the importer shall, by the execution of a bond in such form and for such sum as may be specified by the Assistant Collector of Customs, bind himself to pay, on demand, in respect of such goods as are not proved to the satisfaction of the Assistant Collector of Customs to have been used for the said purpose, an amount equal to the difference between the duty leviable on such goods but for the exemption contained herein and that already paid at the time of importation. TABL ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... ) Ammonium Fluo-ride, MOS Grade (viii) Ammonium Hy-droxide, MOS Grade (ix) Acetone, MOS Grade (x) Butyl Acetate, MOS Grade (xi) Methanol, MOS Grade (xii) Toluene, MOS Grade (xiii) Propanol, MOS Grade (xiv) Xylenes, MOS Grade (xv) Chloroethylene, MOS Grade (xvi) Buffered Oxide Etchant, MOS Grade (xvii) Hydrogen Peroxide (Unstabilised), MOS Grade (xviii) Potassium Hydro-xide Solution, MOS Grade (xix) Crystal, MOS Grade (xx) Isopropyi Alcohol, MOS Grade (xxi) Ammonium Persul-phate, MOS Grade (xxii) Tetra-acetic Acid, MOS Grade (xxiii) Stearic Acid, MOS Grade (xxiv) Ammonium Ci-trate, MOS Grade (xxv) Triammonium Ci-trate, MOS Grade (xxvi) Butyl Carbitol Acetate, MOS Grade Semiconductor Devices 16. 28, 29, 32, 38, 71 Resistive, Conductive, Dielectric, Overglaze or Solder pastes, Composi-tions or inks in packing not exceeding 5 kg. Hybrid Microcircuits, Poten tiometers, Ceramic and Mica Capacitors, Conductive Rub ber Switches/Key-boards, Printed Components, Resis tors other than heating resistors 17. 32 Solder Mask/Resist in ink or film form, with or without associated cata lysts ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... 74 Berrylium Copper Foil Magnetic Sound Heads 36. 38, 39 Chalk loaded Epoxy Resin Magnetic Heads, Tape Deck Mechanisms, Deflection Components 37. 48 (i) Electrolytic Capacitor/ Condenser Tissue paper (ii) Plain/single or double metallised Capacitor, Tissue paper Electrolytic Capacitors Plastic Film Capacitors, Mixed Dielectric Capacitors 38. 76 Etched or Formed Aluminium Foils Electrolytic Capacitors 39. 39 (i) Plain plastic films of thickness 12 microns or below (ii) Metallised plastic films of thickness 12 microns or below Plastic Film Capacitors, Mixed Dielectric Capacitors 40. 39, 69, 73 The following substrates in any form with or without tags : (i) Phenolic/PoIyamide/ SRBP (Synthetic Resin Bonded Paper) Substrates (ii) Enamelled steel substrates (iii) Glass epoxy unclad substrates (iv) Metal clad substrates (v) Ceramic/Alumina substrates Potentiometers, Hybrid microcircuits, Printed components, semiconductor devices 41. 71 Silver alloy strips in coils of width upto 0.434 inches and thickness upto ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... and 20 Watts. 53. 28, 38, 39, 70, 74, 76 (i) Aluminium paste (ii) Ethylene vinyl acetate sheets (EVA) (iii) Primer for EVA (iv) Polyvinyl fluoride (TEDLAR) (v) Tedlar Aluminium Tedlar (vi) Crane glass (vii) Tedlar coated alumi-nium sheet (viii) Phosphorous Oxy-chloride (ix) Halo carbon (CF 4 )/ Freon gas (x) Tinned copper mesh interconnect (xi) Toughened glass with low iron content and transmissivity of minimum 90% or above. Solar cells/modules 54. 39, 71, 76, 78, 85 (i) Glue solvent resin in aliphatic alcohol (ii) Platinum Rhodium wire (iii) Aluminium wire with silicon or magnesium impurity of upto 2% (iv) Gold wire with phosphorous or antimony doping (v) Base solder (silver, lead, antimony based) (vi) Soft solder (lead, indium, silver based) (vii) Gold tin alloy (viii) Preforms, discs, dots, rings, wafers, plates, reparlitors of the following materials: (a) Aluminium silicon (b) Gold boron (c) Molybdenum (d) Lead-tin solder (e) Silver antimony (f) Gold antimony (g) Silver Lead Indium (h) Silver Lead Antimony (i) Solder (j) Lead Tin (k) Silver-Copper-Indium ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... d steel wire dia 0.4 mm to 1.2 mm Lead tabs for electrolytic capacitors 70. 39 Polyphenylene oxide (Flame retardant) resin Deflection components, Capacitors 71. 39 Emcol Vilconate Magnetic tape 72. 28, 31, 70, 74 (i) Suspension of Alumi-nium oxide in binder (ii) Suspension of Tungs-ten Powder and Alumi-nium oxide in binder (iii) Tungsten Rhenium Wire (iv) Triple Carbonate suspension of calcium, barium, strontium in binder Electron guns and electron gun parts 73. 74, 85 OFHC Copper base with weldable steel ring Semiconductor devices 74. 85 Light Emitting Diodes in the form of Chips, wafers or undiced discs Light Emitting Diodes, Lamps and Displays, Hybrid Microcircuits 75. 85 Pin connectors, including dip type, edge type and bellow type Semiconductor Devices, Liquid Crystal Displays, Hybrid Microcircuits 76. 85 Parts of Transmitting Tubes Transmitting Tubes 77. 70, 85 Parts of Cathode Ray Tubes Cathode Ray Tubes 78. 38 Silicon in the form of undiffused wafers, ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... loy with or without palladium with Gold overlay Relays, Switches, Printed Circuit Boards 94. 69, 39, 75, 28 (i) Evaporation Boats or Ceramic (including Bo ron Nitride) (ii) Diffusion Pump oil or fluid Capacitor Grade Metallised Plastic Films 95. 28, 68 (i) Graphite Beams (ii) Graphite Heaters (iii) Graphite Hot Zone Parts (iv) Aluminium Oxide Dressing Stick (v) Silicon Carbide Dressing Stick Semiconductor Devices, Silicon in all forms 96. 48, 59, 84 (i) Denim Paper (ii) Filter Cartridges (iii) Filter elements Magnetic Tape, Capacitor Grade Metallised Plastic Films, Connectors, Relays, Switches, Printed Circuit Boards 97. 85 Testing Sockets Connectors, Semiconductor Devices, Hybrid Micro-circuits 98. 70 (i) (a) TV Glass Bulbs/ Shells (b) CRT Glass Bulbs/ Shells (c) Magnetron Glass Bulbs/Shells Television Picture Tubes, Cathode Ray Tubes or Magnetrons 99. 85 (i) Parts of Rotor Assembly i.e. unwound rotors including com mutator Bush and Speed Governor assembly (ii) Commutator assem-bly or parts thereof (iii) Brush ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... printed circuit boards, copper clad laminates 114. 71, 85 Silfos wire/gate wire/ tinned copper braided wire Semiconductor devices 115. 48, 76 Kraft paper/tissue paper or aluminium foil for voice coil Loudspeakers 116. 83, 85 Tubular rivets of length upto 35 mm and inner diameter of upto 1.5 mm Potentiometers, semiconduc tor devices 117. 38 Collodial graphite in alcohol Resistors (other than heating resistors) 118. 39, 59, 73 Screen mesh of stainless steel/polyester/metallised polyester or nylon (in sizes of mesh 60 or above) Semiconductor devices, printed circuit boards, potentiometers, capacitors including ceramic capacitors, hybrid microcircuits, printed components 119. 39 Polyamide/polyamlde-amide tape, Film or sheet Connectors, capacitors grade metallised plastic Films 120. 37 (i) High resolution, high contrast photographic Films and photo stencil Films (ii) DIAZO (C 6 H 5 N 2 ) Films (iii) Release Film for multiplayer laminates (iv) Dia positive of screen drawing Printed circuit boards, semiconductor de ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... Magnetic sound heads 131. 39 Antistatic materials in the form of tubes, straps, bags, mats, covers, bins, boxes, containers Semiconductor devices, Hybrid Microcircuits 132. 28, 37, 38, 39, 71, 73 (i) Bismuth lead-Tin alloy (ii) Nickel plated steel strip (iii) Freon Solvent TDA-5 (iv) Freon Solvent TDA-55 (v) 3% Silane in nitrogen (vi) Phosphane Silane in nitrogen (vii) Alkyd moulding compound (viii) Neutra clean 68/68D (ix) Freon TMSS (x) Pur-A Masq (xi) Sodium Hypophos-phate (xii) Culmo-Starter (xiii) Culmo-Brightener (xiv) Culmo AN (xv) Culmo IRL (xvi) Freon Solvent TDA-35 (xvii) Freon Solvent TF (xviii) Diborane in Argon (xix) Tin-Silver Antimony alloy Semiconductor devices 133. 28, 29, 34, 38, 81, 85 (i) Glass to metal seals (ii) Lead-Tin alloy rings/ tablets/sticks (iii) Collodial graphite (iv) Collophan Tantalum Capacitors 134. 85 Anode assembly consis ting of EHT cable, silicone rubber cap and contact spring Deflection components 135. 39, 40, 56, 85 (i) PVC Jacket flats (ii) Burnishing/Wiping ..... X X X X Extracts X X X X X X X X Extracts X X X X
|