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Electronic industries raw materials and piece parts for specified end-uses in electronics industry [Chapter 85]

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..... icer not below the rank of a Joint Director in the Department of Electronics of the Government of India or a Joint Director in the Directorate of Industries of the Government of a State or a Director in the Department of Telecommunications of the Government of India or an Additional Industrial Adviser in the Directorate General of Technical Development of the Government of India, as the case may be, is satisfied that the goods in question are required for the purpose as specified in column (4) of the said Table and recommends grant of the above exemption : Provided that this condition shall not apply in the case of goods imported against supplementary import licences; (ii) the importer shall, by the execution of a bond in such form and for such sum as may be specified by the Assistant Collector of Customs, bind himself to pay, on demand, in respect of such goods as are not proved to the satisfaction of the Assistant Collector of Customs to have been used for the said purpose, an amount equal to the difference between the duty leviable on such goods but for the exemption contained herein and that already paid at the time of importation. TABLE S. No. Chapter of the First Schedu .....

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..... e Solution, MOS Grade (xix) Crystal, MOS Grade (xx) Isopropyi Alcohol, MOS Grade (xxi) Ammonium Persul-phate, MOS Grade (xxii) Tetra-acetic Acid, MOS Grade (xxiii) Stearic Acid, MOS Grade (xxiv) Ammonium Ci-trate, MOS Grade (xxv) Triammonium Ci-trate, MOS Grade (xxvi) Butyl Carbitol Acetate, MOS Grade Semiconductor Devices 16. 28, 29, 32, 38, 71 Resistive, Conductive, Dielectric, Overglaze or Solder pastes, Composi-tions or inks in packing not exceeding 5 kg. Hybrid Microcircuits, Poten­tiometers, Ceramic and Mica Capacitors, Conductive Rub­ber Switches/Key-boards, Printed Components, Resis­tors other than heating resistors 17. 32 Solder Mask/Resist in ink or film form, with or without associated cata­lysts Printed Circuit Boards 18. 39 Polyethylene terephtha-late film with ferro magnetic coating of thickness upto 0.005 inch with magnetic coating 100 to 180 micro inch Floppy diskettes 19. 38, 81 Lithium Niobate Wafers Hybrid Microcircuits, Pri­nted Components, SAW Filters 20. 38 Semiconductor Grade Monocrystalline Silicon in the form of bars, rods or ingots Undiffused, Epicoated or Diffused Silicon Wafters, Semiconductor .....

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..... s (iii) Glass epoxy unclad substrates (iv) Metal clad substrates (v) Ceramic/Alumina substrates Potentiometers, Hybrid microcircuits, Printed components, semiconductor devices 41. 71 Silver alloy strips in coils of width upto 0.434 inches and thickness upto 0.006 inches Relays, connectors, switches 42. 39 (i) Synthetic polyelectro-lyte dispersant (ii) Polyethylene adduct and non-ionic surface acting material (ZUSOPL-AST) lubricant Ferrites 43. 74 Electrolytic tough pitch (ETP) Copper wire and wire rods Lead wire for electronic components, resistors (other than heating resistors), potentiometers, capacitors 44. 74 (i) Solder plated brass strips upto 100 mm width (ii) Silver plated brass strips upto 100 mm width Potentiometers, connectors, switches, relays 45. 39 Nylon 6, 30% glass filled. Flame retardant mould-ing powder/granules and with or without other additives Potentiometers 46. 28, 29, 39, 71, 74, 76 (i) Titanium dioxide of purity 99% or above (ii) Reactive alumina super (iii) Neodymium oxide (iv) Liquidising binders (v) Aluminium powders of purity 99% or above (vi) Aluminium foil (Adhesive coated) for thermal bonding (vii) Cop .....

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..... y;manium Arsenic (m) Berrylium Oxide Semiconductor devices 55 78 Lead foil Plastic film capacitors 56. 85 Insulated or enamelled copper wire of 45 SWG or finer than 45 SWG Deflection components, Coils and transformers 57. 74, 85 (i) Oxygen-free high conductivity (OFHC) copper wires, bars, rods, angles, shapes and sections, plates, sheets, strips, tubes and pipes (ii) Parts made of oxygen-free high conductivity copper Semiconductor devices, electronic valves and tubes, transistor headers, glass to metal seals, capacitors, resistors (other than heating resistors), Lead frames 58. 28, 38 Carbon powders, carbon black or carbon suspensions (like Corax L Sevacarb MT and AB carbon) in packings not exceeding 25 kg. Potentiometers, switches, magnetic tape 59. 74 Continuous cast electrolytic grade copper wire-rods of purity of 99.9% and above Electrodeposited copper foil for copper clad laminates 60. 28, 38 Organic additives Electrodeposited copper foil for copper clad laminates 61. 28, 29, 32, 38, 39, 71 (i) Ethoxy ethanol (ii) Polyvinyl butyral (iii) Molybdenum disul-phide (iv) Molybdenum dioxide (v) Xylok 225 (vi) Terpinol Potentiomet .....

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..... ed components 80. 69, 85 Ceramic Dielectric (Un­coated or coated) Ceramic Capacitors 81. 85 (i) Aluminium Leads (ii) Lead/Tabs/Paddle Tabs Electrolytic Capacitors 82. 92 Sapphire Tips Pick-up Cartridges Stylii 83. 39, 48, 85 (i) Paper/Plastic cones (ii) Dampers or Spiders (iii) Domes or Dust Caps (iv) Flat diaphragms Loudspeakers 84. 74 Glass Epoxy Copper Clad Laminates Printed Circuit Boards 85. 84, 85 Parts of Potentiometers Potentiometers 86. 85 Parts of Relays, Switches, Connectors Relays, Switches, Connectors 87. 84, 85, 90 (i) Parts of X-ray Tubes (ii) HT Cables X-ray Tubes 88. 84, 85 Parts of Vacuum Interrupter Tubes Vacuum Interrupter Tubes 89. 38, 73 Precalcined/Pre-sintered Ferrite Powder Ferrites 90. 39, 74, 75, 76 (i) Composite copper clad materials consisting of Paper + Epoxy + Glass Cloth (ii) Copper Clad Lami-nates Laminated to Nylon, Teflon, Poly-ester (iii) Aluminium clad entry foil and back-up laminates Printed Circuit Boards 91. 39, 85 (i) Polyolefins Tubes (ii) Etched Glass with or without Transducers Delay Lines 92. 39, 48, 59 (i) Drafting Aids, Tapes and Doughnuts (inclu­ding .....

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..... Dust Caps for Loudspeakers 104. 28, 29 (i) Electroless Nickel salts/solutions (ii) Sodium Hypophos-phite Glass to metal seals, Lead frames 105. 74 Copper foils (plain or adhesive coated) Copper clad laminates of phenolic or glass epoxy types, multilayer printed circuit boards 106. 38, 85 (i) Getters (ii) Tungsten coils Electronic valves and tubes 107. 40, 59 (i) Bungs (ii) Rubber Pinch rollers with or without plastic bush Electrolytic capacitors, tape deck mechanisms 108. 38, 68, 85 Graphite jigs/blocks/ rods or plates Semiconductor devices, electronic valves and tubes, glass to metal seals, transistor headers and mono-crystalline silicon ingots/ wafers 109. 39 Flexible folding disk jacket with liner Floppy diskettes 110. 72, 73 Solder plated copper plated steel wires of dia 0.04 mm to 0.6 mm Capacitors, resistors (other than heating resistors), RF/IF coils, lead tabs 111. 72 Stainless/heat resisting steel wires of size thinner than 0.31 mm dia (30 SWG) Potentiometers 112. 74 Brass pipes/tubes of thickness 0.2 mm to 0.3 mm (33 SWG with OD of 2.5 mm to 0.3 mm Telescopic antennas 113. 39 Glass epoxy or/and polyamide pro-p .....

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..... mmonia (iv) Dichlorosilane (v) Argon (vi) Etch gas (vii) Hexafluoroethane (viii) 5% phosphine in nitrogen (ix) Freon 14 (x) 15% phosphine in nitrogen (xi) Helium (xii) 15% Arsene in hydrogen (xiii) Boron trifluoride (xiv) Nitrogen in lecture bottles (xv) Sulphur hexafluo­ride 127. 32 Printing ink for printing on aluminium plates Decorative name plates for tape recorders 128. 37, 34, 39 (i) Silicon grease (ii) Cyanoacrylate or anaerobic sealants (iii) Molybdenum based lubricating compound (iv) Kilopoise lubricating grease Potentiometers, tape deck mechanisms, switches, relays, heat sinks, electronic valves and tubes 129. 28, 69 (i) Recrystallised Zirconia (ii) Recrystallised alumi-na crucibles Mounted piezoelectric crys­tals 130. 39, 73, 79, 85 Parts of magnetic sound heads Magnetic sound heads 131. 39 Antistatic materials in the form of tubes, straps, bags, mats, covers, bins, boxes, containers Semiconductor devices, Hybrid Microcircuits 132. 28, 37, 38, 39, 71, 73 (i) Bismuth lead-Tin alloy (ii) Nickel plated steel strip (iii) Freon Solvent TDA-5 (iv) Freon Solvent TDA-55 (v) 3% Silane in nitrogen (vi .....

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