Electronic industries raw materials and piece parts for specified end-uses in electronics industry [Chapter 85] - 094/92 - Customs -Tariff

Electronic industries raw materials and piece parts for specified end-uses in electronics industry [Chapter 85] Notification No. 94/92-Cus. Dated 1-3-1992 In exercise of the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the Central Government, being satisfied that it is necessary in the public interest so to do, hereby exempts the goods specified in column (3) of the Table hereto annexed and falling within the Chapter of the First Schedule to the Customs Tariff Act, 1975 (51 of 1975), specified in the corresponding entry in column (2) of the said Table, when imported into India for the purpose of manufacture of the goods specified in the corresponding entry in column (4) of the said Table, from so much of the duty of customs leviable thereon which is specified in the said First Schedule, as is in excess of the amount calculated at the rate of 35 per cent ad valorem , subject to the following conditions, namely :- (i) an officer not below the rank of a Joint Director in the Department of Electronics of the Government of India or a Joint Director in the Directorate of Industries of the Government of a State or a Director in the Department of Telecommunications of the Government of India or an Additional Industrial Adviser in the Directorate General of Technical Development of the Government of India, as the case may be, is satisfied that the goods in question are required for the purpose as specified in column (4) of the said Table and recommends grant of the above exemption : Provided that this condition shall not apply in the case of goods imported against supplementary import licences; (ii) the importer shall, by the execution of a bond in such form and for such sum as may be specified by the Assistant Collector of Customs, bind himself to pay, on demand, in respect of such goods as are not proved to the satisfaction of the Assistant Collector of Customs to have been used for the said purpose, an amount equal to the difference between the duty leviable on such goods but for the exemption contained herein and that already paid at the time of importation. TABLE S. No. Chapter of the First Schedule to the Customs Tariff Act, 1975 Description of goods For the manufacture of goods (1) (2) (3) (4) 1. 85 Self bonding/Self sold-ering insulated or enamelled copper wire Deflection components, Loudspeakers, Reed switches, Relays, Magnetic Heads, RF/IF Coils or Transformers and DC Micromotors of voltage rating upto 13.5 volts and not exceeding 20 watts rating, electronic tuner 2. 39 Polariser sheets Liquid Crystal Displays 3. 70 Glass plates having transmission 85% and above Liquid Crystal Displays 4. 32 Electron Phosphor Electronic Valves and Tubes 5. 85 Liquid Crystal Material Liquid Crystal Displays 6. 38 Barium Titanate based ceramic compositions Semiconductor devices, silvered or unsilvered discs/ dielectrics 7. 28 Germanium Dioxide Semiconductor Devices 8. 28 Gamma Ferric Oxide Magnetic inks or Magnetic Tape 9. 28 (i) Gallium Arsenide Phosphide (ii) Gallium Phosphide Semiconductor Devices 10. 28 Gallium Phosphide in the form of discs, wafers or similar forms Semiconductor Devices 11. 28, 29, 38, 71 Dopants or Doping Sources in all forms and with or without precious metal constituents Semiconductor Devices, Silicon Single Crystals or Wafers 12. 37, 70 (i) High Resolution Photo Plates (ii) Photomask Substra-tes High Resolution Photo Masks, Semiconductor Devices, Printed Circuit Boards, Lead Frames, Liquid Crystal Displays, Silicone Single Crystals or Wafers 13. 37, 28, 29 (i) Photo resist thinners Semiconductor Devices, Printed Circuit (ii) Photospin Glass Boards, Liquid Crystal Displays, Lead Frames or Resistors (other than Heating Resistors) Hybrid Micro circuits, Printed Components 14. 28, 29, 34 Resist Stripper Semiconductor Devices, Printed Circuit Boards 15. 28,29 (i) Acetic Acid, MOS Grade (ii) Hydrofluoric Acid, MOS Grade (iii) Nitric Acid, MOS Grade (iv) Phosphoric Acid, MOS Grade (v) Sulphuric Acid, MOS Grade (vi) Hydrochloric Acid, MOS Grade (vii) Ammonium Fluo-ride, MOS Grade (viii) Ammonium Hy-droxide, MOS Grade (ix) Acetone, MOS Grade (x) Butyl Acetate, MOS Grade (xi) Methanol, MOS Grade (xii) Toluene, MOS Grade (xiii) Propanol, MOS Grade (xiv) Xylenes, MOS Grade (xv) Chloroethylene, MOS Grade (xvi) Buffered Oxide Etchant, MOS Grade (xvii) Hydrogen Peroxide (Unstabilised), MOS Grade (xviii) Potassium Hydro-xide Solution, MOS Grade (xix) Crystal, MOS Grade (xx) Isopropyi Alcohol, MOS Grade (xxi) Ammonium Persul-phate, MOS Grade (xxii) Tetra-acetic Acid, MOS Grade (xxiii) Stearic Acid, MOS Grade (xxiv) Ammonium Ci-trate, MOS Grade (xxv) Triammonium Ci-trate, MOS Grade (xxvi) Butyl Carbitol Acetate, MOS Grade Semiconductor Devices 16. 28, 29, 32, 38, 71 Resistive, Conductive, Dielectric, Overglaze or Solder pastes, Composi-tions or inks in packing not exceeding 5 kg. Hybrid Microcircuits, Poten tiometers, Ceramic and Mica Capacitors, Conductive Rub ber Switches/Key-boards, Printed Components, Resis tors other than heating resistors 17. 32 Solder Mask/Resist in ink or film form, with or without associated cata lysts Printed Circuit Boards 18. 39 Polyethylene terephtha-late film with ferro magnetic coating of thickness upto 0.005 inch with magnetic coating 100 to 180 micro inch Floppy diskettes 19. 38, 81 Lithium Niobate Wafers Hybrid Microcircuits, Pri nted Components, SAW Filters 20. 38 Semiconductor Grade Monocrystalline Silicon in the form of bars, rods or ingots Undiffused, Epicoated or Diffused Silicon Wafters, Semiconductor Devices 21. 70 High resolution photo mask Semiconductor devices, printed circuit boards, Liquid crystal displays or Lead frame 22. 70 Parts of TV/CRT Glass bulbs/shells including panels, tunnels, Glass tubes (including neck or reneck tubes) (1) TV Glass bulbs/shells for TV picture tube (2) CRT Glass bulbs/shells for CRT 23. 28 Silicon Monoxide Lumps Liquid Crystal Displays, metal film resistors 24. 47 Bleached or unbleached Sulphide paper pulp or wood pulp Paper Cones for Loudspea-kers 25. 28, 29, 38 (i) Electrolyte Etched or Formed Aluminium Foil, (ii) Caplyte Electrolytic Capacitors 26. 81 Indium Electronic Grade Indium 27. 37 Photo Polymer Film Semiconductor Devices, Printed Circuit Boards, Liquid Crystal Displays, Lead Frames or Resistors (other than Heating Resistors) 28. 28, 32 (i) Ferric Oxide of purity 99% and above (ii) Manganese Oxide of purity 99% and above (iii) Manganese Dioxide of purity 99% and above (iv) Manganese Carbo-nate of purity 99% and above (v) Manganous Oxide (vi) Nickel Oxide (vii) Strontium Carbonate Ferrites 29. 28 Chromium di-oxide Magnetic Inks or Magnetic Tapes 30. 28 Silicon Tetrachloride Semiconductor Devices 31. 28 Ammonium Pentaborate Electrolytic Capacitors 32. 81, 85 Bismuth-Cadmium alloys in all forms Semiconductor Devices 33. 28 Barium Carbonate of purity 98% and above Ceramic Capacitors, Electro-nic valves and tubes 34. 32, 38 (i) Internal Dag (ii) External Dag Electronic Valves and Tubes, Resistors (other than Heating Resistors) 35. 74 Berrylium Copper Foil Magnetic Sound Heads 36. 38, 39 Chalk loaded Epoxy Resin Magnetic Heads, Tape Deck Mechanisms, Deflection Components 37. 48 (i) Electrolytic Capacitor/ Condenser Tissue paper (ii) Plain/single or double metallised Capacitor, Tissue paper Electrolytic Capacitors Plastic Film Capacitors, Mixed Dielectric Capacitors 38. 76 Etched or Formed Aluminium Foils Electrolytic Capacitors 39. 39 (i) Plain plastic films of thickness 12 microns or below (ii) Metallised plastic films of thickness 12 microns or below Plastic Film Capacitors, Mixed Dielectric Capacitors 40. 39, 69, 73 The following substrates in any form with or without tags : (i) Phenolic/PoIyamide/ SRBP (Synthetic Resin Bonded Paper) Substrates (ii) Enamelled steel substrates (iii) Glass epoxy unclad substrates (iv) Metal clad substrates (v) Ceramic/Alumina substrates Potentiometers, Hybrid microcircuits, Printed components, semiconductor devices 41. 71 Silver alloy strips in coils of width upto 0.434 inches and thickness upto 0.006 inches Relays, connectors, switches 42. 39 (i) Synthetic polyelectro-lyte dispersant (ii) Polyethylene adduct and non-ionic surface acting material (ZUSOPL-AST) lubricant Ferrites 43. 74 Electrolytic tough pitch (ETP) Copper wire and wire rods Lead wire for electronic components, resistors (other than heating resistors), potentiometers, capacitors 44. 74 (i) Solder plated brass strips upto 100 mm width (ii) Silver plated brass strips upto 100 mm width Potentiometers, connectors, switches, relays 45. 39 Nylon 6, 30% glass filled. Flame retardant mould-ing powder/granules and with or without other additives Potentiometers 46. 28, 29, 39, 71, 74, 76 (i) Titanium dioxide of purity 99% or above (ii) Reactive alumina super (iii) Neodymium oxide (iv) Liquidising binders (v) Aluminium powders of purity 99% or above (vi) Aluminium foil (Adhesive coated) for thermal bonding (vii) Copper band, silver plated/ solder coated (viii) Furoic acid Piezoelectric elements, transducers 47. 15, 29, 32, 34, 39, 48, 70 The following items : (i) Alpha cellulose paper/ cotton paper (ii) Electrical grade craft paper (iii) Tung oil (iv) Volan/Silane treated glass fabric/cloth (v) Silane Copper clad laminates phenolic or paper phenolic or glass epoxy types printed circuit boards 48. 48, 59 (i) Silicone coated paper roll (ii) Pressure sensitive felt Cassettes, cassette parts 49. 59 Felt sheet (fully com-pressed) of 1.5 mm thickness and below Tape deck mechanisms 50. 32, 35, 39, 40, 74, 76, 85 (i) Posyn wire, thermoplac wire (ii) Cellulose triacetate foil (iii) Cellulose acetate butyrate foil (iv) Copper-cadmium braided wire (v) Self-soldering/self-bonding aluminium wire Loudspeakers, microphones 51. 39, 71, 74 (i) Gold plated twisted wire upto 0.4 mm dia (ii) Tin plated copper wire upto 0.4 mm dia (iii) Epoxy solder glue Delay lines 52. 72, 73, 74, 76 (i) Iron of 99.7% purity or above (ii) Copper of 99.9% purity or above Cast Alloy Permanent Magnets, when imported by the manufacturers of such magnets and DC micro-motors of voltage rating not exceeding 13.5 V and 20 Watts. 53. 28, 38, 39, 70, 74, 76 (i) Aluminium paste (ii) Ethylene vinyl acetate sheets (EVA) (iii) Primer for EVA (iv) Polyvinyl fluoride (TEDLAR) (v) Tedlar Aluminium Tedlar (vi) Crane glass (vii) Tedlar coated alumi-nium sheet (viii) Phosphorous Oxy-chloride (ix) Halo carbon (CF 4 )/ Freon gas (x) Tinned copper mesh interconnect (xi) Toughened glass with low iron content and transmissivity of minimum 90% or above. Solar cells/modules 54. 39, 71, 76, 78, 85 (i) Glue solvent resin in aliphatic alcohol (ii) Platinum Rhodium wire (iii) Aluminium wire with silicon or magnesium impurity of upto 2% (iv) Gold wire with phosphorous or antimony doping (v) Base solder (silver, lead, antimony based) (vi) Soft solder (lead, indium, silver based) (vii) Gold tin alloy (viii) Preforms, discs, dots, rings, wafers, plates, reparlitors of the following materials: (a) Aluminium silicon (b) Gold boron (c) Molybdenum (d) Lead-tin solder (e) Silver antimony (f) Gold antimony (g) Silver Lead Indium (h) Silver Lead Antimony (i) Solder (j) Lead Tin (k) Silver-Copper-Indium (l) Silver-Copper- Ger manium Arsenic (m) Berrylium Oxide Semiconductor devices 55 78 Lead foil Plastic film capacitors 56. 85 Insulated or enamelled copper wire of 45 SWG or finer than 45 SWG Deflection components, Coils and transformers 57. 74, 85 (i) Oxygen-free high conductivity (OFHC) copper wires, bars, rods, angles, shapes and sections, plates, sheets, strips, tubes and pipes (ii) Parts made of oxygen-free high conductivity copper Semiconductor devices, electronic valves and tubes, transistor headers, glass to metal seals, capacitors, resistors (other than heating resistors), Lead frames 58. 28, 38 Carbon powders, carbon black or carbon suspensions (like Corax L Sevacarb MT and AB carbon) in packings not exceeding 25 kg. Potentiometers, switches, magnetic tape 59. 74 Continuous cast electrolytic grade copper wire-rods of purity of 99.9% and above Electrodeposited copper foil for copper clad laminates 60. 28, 38 Organic additives Electrodeposited copper foil for copper clad laminates 61. 28, 29, 32, 38, 39, 71 (i) Ethoxy ethanol (ii) Polyvinyl butyral (iii) Molybdenum disul-phide (iv) Molybdenum dioxide (v) Xylok 225 (vi) Terpinol Potentiometers, ceramic capacitors 62. 29 Ethylene glycol monomethyl ether or its formulations Semiconductor devices 63. 28, 29, 35, 25, 38 (i) Sorbitol flux (ii) Hydroxy Propyi methyl Cellulose (iii) Vegetable glue (iv) Preventol (v) Rhodovial Ceramic capacitors, Ceramic substrates/rods 64. 28, 29 (a) Triethanalamine (b) Dimethyl formamide (c) Dimethyl acetamide (d) Dimethylamine Etched or formed aluminium foil for electrolytic capacitors 65. 85 Parts of Electron Guns excluding beaded body Electron Guns Television picture tubes or Cathode Ray Tubes 66. 28, 68 (i) Tantalum Neodyme oxide (ii) Neodyme oxide (iii) Strontium carbonate Ceramic Capacitors 67. 29, 39 (i) Ethane VG (Trichloro ethane) (ii) Diaflon (Trichlore trifluro ethane) Deflection components 68. 29 Tetrahydrofuran Magnetic tapes 69. 73 Copper clad tin coated steel wire dia 0.4 mm to 1.2 mm Lead tabs for electrolytic capacitors 70. 39 Polyphenylene oxide (Flame retardant) resin Deflection components, Capacitors 71. 39 Emcol Vilconate Magnetic tape 72. 28, 31, 70, 74 (i) Suspension of Alumi-nium oxide in binder (ii) Suspension of Tungs-ten Powder and Alumi-nium oxide in binder (iii) Tungsten Rhenium Wire (iv) Triple Carbonate suspension of calcium, barium, strontium in binder Electron guns and electron gun parts 73. 74, 85 OFHC Copper base with weldable steel ring Semiconductor devices 74. 85 Light Emitting Diodes in the form of Chips, wafers or undiced discs Light Emitting Diodes, Lamps and Displays, Hybrid Microcircuits 75. 85 Pin connectors, including dip type, edge type and bellow type Semiconductor Devices, Liquid Crystal Displays, Hybrid Microcircuits 76. 85 Parts of Transmitting Tubes Transmitting Tubes 77. 70, 85 Parts of Cathode Ray Tubes Cathode Ray Tubes 78. 38 Silicon in the form of undiffused wafers, discs or chips Semiconductor devices 79. 69, 78, 85 (i) Headers (ii) Caps with or without leads (iii) Cans with or without leads (iv) Pins (v) Stud seals (vi) Lead beads (vii) Ceramic beads (viii) Ceramic-glass pac kages (ix) Cap to Lead Assem blies (x) Ceramic Pipes (xi) Lead Frames, single or in roll form (xii) Housings (xiii) Brass ring Semiconductor devices, Resistors (other than Heating Resistors), Capacitors, Connectors, Hybrid Micro-circuits, Printed components 80. 69, 85 Ceramic Dielectric (Un coated or coated) Ceramic Capacitors 81. 85 (i) Aluminium Leads (ii) Lead/Tabs/Paddle Tabs Electrolytic Capacitors 82. 92 Sapphire Tips Pick-up Cartridges Stylii 83. 39, 48, 85 (i) Paper/Plastic cones (ii) Dampers or Spiders (iii) Domes or Dust Caps (iv) Flat diaphragms Loudspeakers 84. 74 Glass Epoxy Copper Clad Laminates Printed Circuit Boards 85. 84, 85 Parts of Potentiometers Potentiometers 86. 85 Parts of Relays, Switches, Connectors Relays, Switches, Connectors 87. 84, 85, 90 (i) Parts of X-ray Tubes (ii) HT Cables X-ray Tubes 88. 84, 85 Parts of Vacuum Interrupter Tubes Vacuum Interrupter Tubes 89. 38, 73 Precalcined/Pre-sintered Ferrite Powder Ferrites 90. 39, 74, 75, 76 (i) Composite copper clad materials consisting of Paper + Epoxy + Glass Cloth (ii) Copper Clad Lami-nates Laminated to Nylon, Teflon, Poly-ester (iii) Aluminium clad entry foil and back-up laminates Printed Circuit Boards 91. 39, 85 (i) Polyolefins Tubes (ii) Etched Glass with or without Transducers Delay Lines 92. 39, 48, 59 (i) Drafting Aids, Tapes and Doughnuts (inclu ding Transfer type and transfer alphabets and numerals) (ii) Drafting film (inclu ding cut and peel film) for master artwork preparation Printed Circuit Boards, Semiconductor Devices, Potentiometers, Hybrid Microcircuits, Printed components 93. 71 (i) Contact tape with pure Nickel base and Crown Gold alloy (ii) Contact tape with solder Diamond Back in fine silver (iii) Contact tape in silver or silver alloy with or without palladium with Gold overlay Relays, Switches, Printed Circuit Boards 94. 69, 39, 75, 28 (i) Evaporation Boats or Ceramic (including Bo ron Nitride) (ii) Diffusion Pump oil or fluid Capacitor Grade Metallised Plastic Films 95. 28, 68 (i) Graphite Beams (ii) Graphite Heaters (iii) Graphite Hot Zone Parts (iv) Aluminium Oxide Dressing Stick (v) Silicon Carbide Dressing Stick Semiconductor Devices, Silicon in all forms 96. 48, 59, 84 (i) Denim Paper (ii) Filter Cartridges (iii) Filter elements Magnetic Tape, Capacitor Grade Metallised Plastic Films, Connectors, Relays, Switches, Printed Circuit Boards 97. 85 Testing Sockets Connectors, Semiconductor Devices, Hybrid Micro-circuits 98. 70 (i) (a) TV Glass Bulbs/ Shells (b) CRT Glass Bulbs/ Shells (c) Magnetron Glass Bulbs/Shells Television Picture Tubes, Cathode Ray Tubes or Magnetrons 99. 85 (i) Parts of Rotor Assembly i.e. unwound rotors including com mutator Bush and Speed Governor assembly (ii) Commutator assem-bly or parts thereof (iii) Brush assembly or parts thereof (iv) Mechanical speed governor assembly or parts thereof DC Micromotors of voltage rating upto 13.5 volts and not exceeding 20 watts rating 100. 85 Resistor elements/chips with TCR 5 ppm per degree centigrade Chip Resistors/Bulk Metal Film Resistors or Bulk Metal Resistors 101. 28 Selenium Rectifier Plates of Grade E-25 Selenium TV Rectifiers 102. 74, 85 Rayon or Silk cover Litz wire in the following sizes, namely :- (i) 24 (strands) x 0.03 mm (diameter of each strand) (ii) 12 (strands) x 0.03 mm (diameter of each strand) (iii) 9 (strands) x 0.04 mm (diameter of each strand) (iv) 6 (strands) x 0.04 mm (diameter of each strand) (v) 8 (strands) x 0.03 mm (diameter of each strand) (vi) 6 (strands) x 0.03 mm (diameter of each strand) RF/IF Coils or transformers 103. 74 Phosphor Bronze wire nettings (60 mesh or above) Cones, Spiders, Dust Caps for Loudspeakers 104. 28, 29 (i) Electroless Nickel salts/solutions (ii) Sodium Hypophos-phite Glass to metal seals, Lead frames 105. 74 Copper foils (plain or adhesive coated) Copper clad laminates of phenolic or glass epoxy types, multilayer printed circuit boards 106. 38, 85 (i) Getters (ii) Tungsten coils Electronic valves and tubes 107. 40, 59 (i) Bungs (ii) Rubber Pinch rollers with or without plastic bush Electrolytic capacitors, tape deck mechanisms 108. 38, 68, 85 Graphite jigs/blocks/ rods or plates Semiconductor devices, electronic valves and tubes, glass to metal seals, transistor headers and mono-crystalline silicon ingots/ wafers 109. 39 Flexible folding disk jacket with liner Floppy diskettes 110. 72, 73 Solder plated copper plated steel wires of dia 0.04 mm to 0.6 mm Capacitors, resistors (other than heating resistors), RF/IF coils, lead tabs 111. 72 Stainless/heat resisting steel wires of size thinner than 0.31 mm dia (30 SWG) Potentiometers 112. 74 Brass pipes/tubes of thickness 0.2 mm to 0.3 mm (33 SWG with OD of 2.5 mm to 0.3 mm Telescopic antennas 113. 39 Glass epoxy or/and polyamide pro-pregs Multilayer printed circuit boards, copper clad laminates 114. 71, 85 Silfos wire/gate wire/ tinned copper braided wire Semiconductor devices 115. 48, 76 Kraft paper/tissue paper or aluminium foil for voice coil Loudspeakers 116. 83, 85 Tubular rivets of length upto 35 mm and inner diameter of upto 1.5 mm Potentiometers, semiconduc tor devices 117. 38 Collodial graphite in alcohol Resistors (other than heating resistors) 118. 39, 59, 73 Screen mesh of stainless steel/polyester/metallised polyester or nylon (in sizes of mesh 60 or above) Semiconductor devices, printed circuit boards, potentiometers, capacitors including ceramic capacitors, hybrid microcircuits, printed components 119. 39 Polyamide/polyamlde-amide tape, Film or sheet Connectors, capacitors grade metallised plastic Films 120. 37 (i) High resolution, high contrast photographic Films and photo stencil Films (ii) DIAZO (C 6 H 5 N 2 ) Films (iii) Release Film for multiplayer laminates (iv) Dia positive of screen drawing Printed circuit boards, semiconductor devices, potentiometers, capacitors, hybrid microcircuits, printed components 121. 48, 59 Lint free towels/paper Potentiometers, semiconduc-tor devices, hybrid micro-circuits, printed components 122. 39 Heat Shrinkable PVC sleeving, tubing, Film or ring Capacitors, semiconductor devices, DC Micromotors, relays, deflection compo-nents 123. 39 Splicing tape Magnetic tape cassettes 124. 39, 48 Insulating/taping material (including pocket carrier tape) in tape, roll or strip form with or without adhesives Capacitors, deflection components, resistors (other than heating resistors), printed circuit boards, potentiometers, semiconduc-tor devices, Inductors. 125. 85, 84, 58, 69 (i) Silicon carbide heating elements (ii) Super Kanthal heating elements (iii) Silicon carbide rollers (iv) Inconel steel rollers (v) Conveying trays (vi) TP Furnace and trays (vii) Saggers Ferrites, ceramic capacitors, potentiometers, semiconduc-tor devices 126. 28, 34, 39, 48, 61, 68, 70, 82, 84, 85 (a) Mica and Micualex washers (b) Parts of doping systems (c) Plastic Film for wafer dicing (d) Sputtor targets (e) Etch disc (f) Film Template (g) Special Gases Semiconductor devices, silicon in all forms, Hybrid Microcircuits (i) Hydrogen chloride (ii) 100% silane (iii) Ammonia (iv) Dichlorosilane (v) Argon (vi) Etch gas (vii) Hexafluoroethane (viii) 5% phosphine in nitrogen (ix) Freon 14 (x) 15% phosphine in nitrogen (xi) Helium (xii) 15% Arsene in hydrogen (xiii) Boron trifluoride (xiv) Nitrogen in lecture bottles (xv) Sulphur hexafluo ride 127. 32 Printing ink for printing on aluminium plates Decorative name plates for tape recorders 128. 37, 34, 39 (i) Silicon grease (ii) Cyanoacrylate or anaerobic sealants (iii) Molybdenum based lubricating compound (iv) Kilopoise lubricating grease Potentiometers, tape deck mechanisms, switches, relays, heat sinks, electronic valves and tubes 129. 28, 69 (i) Recrystallised Zirconia (ii) Recrystallised alumi-na crucibles Mounted piezoelectric crys tals 130. 39, 73, 79, 85 Parts of magnetic sound heads Magnetic sound heads 131. 39 Antistatic materials in the form of tubes, straps, bags, mats, covers, bins, boxes, containers Semiconductor devices, Hybrid Microcircuits 132. 28, 37, 38, 39, 71, 73 (i) Bismuth lead-Tin alloy (ii) Nickel plated steel strip (iii) Freon Solvent TDA-5 (iv) Freon Solvent TDA-55 (v) 3% Silane in nitrogen (vi) Phosphane Silane in nitrogen (vii) Alkyd moulding compound (viii) Neutra clean 68/68D (ix) Freon TMSS (x) Pur-A Masq (xi) Sodium Hypophos-phate (xii) Culmo-Starter (xiii) Culmo-Brightener (xiv) Culmo AN (xv) Culmo IRL (xvi) Freon Solvent TDA-35 (xvii) Freon Solvent TF (xviii) Diborane in Argon (xix) Tin-Silver Antimony alloy Semiconductor devices 133. 28, 29, 34, 38, 81, 85 (i) Glass to metal seals (ii) Lead-Tin alloy rings/ tablets/sticks (iii) Collodial graphite (iv) Collophan Tantalum Capacitors 134. 85 Anode assembly consis ting of EHT cable, silicone rubber cap and contact spring Deflection components 135. 39, 40, 56, 85 (i) PVC Jacket flats (ii) Burnishing/Wiping Tape (iii) Tyvec sleeves (iv) PVC Jacket cutting laminated with non-woven liner cloth (v) Hub Ring (vi) Lap film Floppy diskettes 136. 40, 55, 81 (i) Zirconium Trays (ii) Zirconium Setters Ceramic capacitors 137. 85 Parts of video head drum assembly Video tape deck mechanism, Video head drum assembly