Electronic Industry - Specified goods used therein - Amendment to Notification No. 64/95-Cus. - 89/95 - Customs -Tariff

Electronic Industry - Specified goods used therein - Amendment to Notification No. 64/95-Cus. Notification No. 89/95-Cus. Dated 27-4-1995 In exercise of the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the Central Government, being satisfied that it is necessary in the public interest so to do, hereby makes the following amendments in the notification of the Government of India in the Ministry of Finance (Department of Revenue) No. 64/95-Customs, dated the 16th March, 1995, namely :- In the Table annexed to the said notification, 1. in LIST A, - (a) against Sl. No. 8, for the entry in column (4), the entry "Semiconductor Devices, Light Emitting Diodes." shall be substituted; (b) against Sl. No. 9, for the entry in column (4), the entry Semiconductor Devices, Light Emitting Diodes." shall be substituted; (c) against Sl. No. 22, in column (4), for the words "semiconductor devices", the words "semiconductor devices, Light Emitting Diodes" shall be substituted; 2. in LIST B, -; (a) against Sl. No. 4, in column (4), for the word "Potentiometers", the words "Potentiometers, Resistors (other than heating resistors)" shall be substituted; (b) against Sl. No. 25, in column (4), for the words "Semiconductor Devices", the words "Semiconductor devices, Light Emitting Diodes" shall be substituted; (c) against Sl. No. 26, in column (4), for the words "Semiconductor devices", the words "Semiconductor devices, Light Emitting Diodes" shall be substituted; (d) against Sl. No. 41, in column (4), for the words "Semiconductor devices", the words "Semiconductor devices, Light Emitting Diodes" shall be substituted; (e) for Sl. No. 49 and entries relating thereto, the following Sl. No. and entries shall be substituted, namely :- (1) (2) (3) (4) "49. 74 (i) Electrolytic Tough Pitch (ETP) Copper wire and wire rods Capacitoras (ii) Electrolytic Tough Pitch (ETP) copper wire rods Lead wire for electronic components."; (f) against Sl. No. 51, in column (4), for the words "tape deck mechanisms" the words "tape deck mechanism, connectors" shall be substituted; (g) against Sl. No. 68, in column (4), for the words "Semiconductor Devices", the words "Semiconductor Devices, Light Emitting Diodes, Moulded Piezoelectric Crystals" shall be substituted; (h)against Sl. No. 78, in column (4), for the words "Semiconductor Devices", the words "Semiconductor Devices, Light Emitting Diodes" shall be substituted; (i) against Sl. No. 92, in column (4), for the entry, the entry "Ferrites, Magnetic Tape" shall be substituted; (j) against Sl. No. 109, in column (2), for the entry, the entry "40, 84, 85" shall be substituted; (k) against Sl. No. 113, in column (4), for the words "Hybrid Microcircuits", the words "Hybrid Microcircuits, Electron Guns and Electron Gun parts" shall be substituted; (l) after Sl. No. 145 and entries relating thereto, the following Sl. Nos. and entries shall be added, namely :- (1) (2) (3) (4) "146. 28, 35, 38, 73, 81 (i) Barium Bromide Gas Discharge tubes (ii) Sodium Aluminate (iii) Barium Aluminate (iv)Methoklone/Methylchloride/Di-chloro methane (v) Titanium metal Powder (99% purity) (vi) Cesium Glass Powder (vii) Barium Glass Powder (viii) Argon-Neon mixed gas (99% purity) (ix) Argon-Hydrogen mixed gas (99% purity) (x) Copper plied steel wire (Tin plated) with die upto 1.5 mm (xi) Adhesive paste Gas discharge Tubes. 147. 28, 29, 32, 34, 38, 39, 48, 69, 74, 85 (i) Ceramic bodies (coated/uncoated) (ii) Bandoliering tape with or without adhesive (iii) Solder plated copper wire of dia upto 1 mm (iv) Solder plated brass wire of dia upto 1 mm (v) High melting point solder alloy (vi) Paper backed polyurethane tape (vii) Epoxy marking ink with or without hardner/thinner Thermistors 148. 29 (i) Metaparacresol (ii) Paraformaldehyde (iii)Melamine (iv) Nonyl Phenol (v) Phenol (vi) Tetra Bromo Bisphenol-A (vii) Tricresyl/Aryl Phosphate (viii) Iso Propyl Alcohol (ix) Mono Methyether or Ethylene Glycol Copper clad lami- nates for Printed Circuit Boards."