Electronic Industry goods - Effective rate of duty - 64/95 - Customs -Tariff

Rescinded vide Notification No. 21/97-Cus dated 1-3-1997 Electronic Industry goods - Effective rate of duty Notification No. 64/95-Cus. Dated 16-3-1995 In exercise of the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the Central Government, being satisfied that it is necessary in the public interest so to do, hereby exempts the goods specified in column (3) of the Table annexed and falling within one or more Chapters of First Schedule to the Customs Tariff Act, 1975, specified in the corresponding entry in column (2) of the said Table, when imported into India, for the purpose of manufacture of goods specified in the corresponding entry in column (4) of the said Table (hereinafter referred to as the said finished goods) from so much of that portion of the duty of customs leviable thereon which is specified in the said First Schedule, as is in excess of amount calculated at the rate of 15% ad valorem, subject to the condition that in case of import of goods covered by List B of the said Table, the importer furnishes, at the time of importation, to the Assistant Collector of Customs, an undertaking to the efffect that : (a) the said imported goods shall be used for the purpose specified above; (b) the importer shall, within three months or such extended period as the Assistant Collector of Customs may, specify in this behalf, produce a certificate from the Assistant Collector of Central Excise in whose jurisdiction the factory manufacturing such finished goods is situated, to the effect that the said goods have been used in the manufacture of the said finished goods; and (c) the importer shall pay, on demand, in the event of his failure to comply with (a) and (b) above, an amount equal to the difference between the duty leviable on such quanity of the said goods but for the exemption contained herein and that already paid at the time of importation: Provided that the goods specified against Sl. No. 14 of List B of the said Table, shall also be exempted from the whole of the additional duty of customs leviable thereon under section 3 of the Customs Tariff Act, 1975 (51 of 1975). TABLE S.No. Chapter of the First Schedule to the Customs Tariff Act, 1975 Description of goods Finished goods (1) (2) (3) (4) LIST A 1. 85 Self bonding/Self soldering insulated or enamelled copper wire Deflection components, Loudspeakers, Relays, Magnetic Heads, RF/IF Coils or Transformers and DC Micromotors upto 13.5 volts and not exceeding 20 watts rating, electronic tuner. 2. 39 Polariser sheets Liquid Crystal Displays. 3. 70 Glass plates having transmis-sion 85% and above Liquid Crystal Displays. 4. 32 Electron Phosphor Electronic Valves and Tubes. 5. 85 Liquid Crystal Material Liquid Crystal Displays. 6. 28 Germanium Dioxide Semiconductor Devices. 7. 28 Gamma Ferric Oxide Magnetic inks or Magnetic Tape. 8. 28 (i) Gallium Arsenide Phosphide (ii) Gallium Phosphide Semiconductor Devices. 9. 28 Gallium Phosphide in the form of discs, wafers or similar forms Semiconductor Devices. 10. 28, 29, 38, 71 Dopants or Doping Sources in all forms and with or without precious metal constituents Semiconductor Devices, Silicon Single Crystals or Wafers. 11. 37, 70 (i) High Resolution Photo Plates (ii) Photomask Substrates High Resolution Photo Masks, Semiconductor devices, Liquid Crystal Displays, Silicon Single Crystals or Wafers. 12. 28, 29 (i) Acetic Acid, MOS/CMOS Grade (ii) Hydrofluoric Acid, MOS/CMOS Grade (iii) Nitric Acid, MOS/CMOS Grade (iv) Phosphoric Acid, MOS/CMOS Grade (v) Sulphuric Acid, MOS/CMOS Grade (vi) Hydrochloric Acid, MOS/CMOS Grade. (vii) Ammonium Fluoride, MOS/CMOS Grade (viii) Ammonium Hydro-xide, MOS/CMOS Grade (ix) Acetone, MOS/CMOS Grade (x) Iso/n-Butyl Acetate, MOS/CMOS Grade (xi) Methanol, MOS/CMOS Grade (xii) Propanol, MOS/CMOS Grade (xiii) Xylenes, MOS/CMOS Grade (xiv) Chloroethylene, MOS/CMOS Grade (xv) Buffered Oxide Etchant, MOS/CMOS Grade (xvi) Hydrogen Peroxide, MOS/CMOS Grade (xvii) Crystal MOS Grade (xviii) Isopropyl Alcohol MOS/CMOS Grade (xix) Triammonium Citrate MOS/CMOS Grade Semiconductor Devices 13. 38, 81 Lithium Niobate Wafers Hybrid Microcircuits. 14. 38 Semiconductor Grade Monocrystalline Silicon in the form of bars, rods or ingots Undiffused, Epicoated or Diffused Silicon Wafers, Semiconductor Devices. 15. 37, 70 High resolution photo mask Semiconductor devices, printed circuit boards, Liquid crystal displays. 16. 81 High Purity Chromium (99.99% and above) in the form of wire, strips, flats, ribbons or powder Semiconductor Devices, Mounted Piezoelectric Crystals, Electronic Valves and tubes, vacuum interruptor tubes. 17. 28 Selenium of purity of 99.99% and above Selenium Rectifiers. 18. 28, 29, 38 Electrolyte Etched or Formed Aluminium Foil, Electrolytic Capacitors. 19. 81 Indium Electronic grade Indium. 20. 32, 38 (i) Internal Dag (ii) External Dag Electronic Valves and Tube. 21. 76 Etched or formed Aluminium Foils Electrolytic Capacitors. 22. 39, 69, 73, 85 The following substrates in any form with or without tags: Potentiometers, Hybrid microcircuits, Printed components, semiconductor devices. (i) Phenolic/Polyamide/ SRBP (Synthetic Resin Bonded Paper) Substrates (ii) Enamelled steel substrates (iii) Glass epoxy unclad substrates (iv) Metal clad substrates (v) Ceramic/Alumina substrates 23. 74, 85 OFHC Copper base with weldable steel ring Semiconductor devices. 24. 85 Parts of gas discharge tubes Gas discharge tubes. 25. 85 Light Emitting Diodes in the form of Chips, wafers or undiced discs Light Emitting Diodes, Lamps and Displays. 26. 85 Parts of Transmitting Tubes Transmitting Tubes. 27. 85 Parts of Cathode Ray Tubes (other than Glass parts) Cathode Ray Tubes. 28. 38 Silicon in the form of undiffused wafers, discs or chips Semiconductor devices. 29. 69, 85 Ceramic Dielectric (coated or uncoated) Ceramic Capacitors. 30. 85 Lead/Tabs/Paddle Tabs Electrolytic Capacitors. 31. 39, 48, 85 (i) Dampers or Spiders (ii) Domes or Dust Caps Loudspeakers. 32. 84, 85 Parts of Potentiometers Potentiometers. 33. 85 Parts of Relays, Switches, Connectors Relays, Switches, Connectors. 34. 84, 85, 90 Parts of X-ray Tubes X-ray Tubes. 35. 84, 85 Parts of Vacuum Interruptor Tube Vacuum Interruptor Tubes. 36. 85 Resistor elements/chips with TCR 5 ppm per degree centigrade Chip Resistors/Bulk Metal Film Resistors or Bulk Metal Resistors. 37. 28 Selenium Rectifier Plates of Grade E-25 Selenium TV Rectifiers. 38. 71 Synthetic quartz crystal blocks and blanks Mounted Piezoelectric crystals. 39. 39 Glass epoxy or/and polyamide prepregs Multilayer printed circuit boards, copper clad laminates. 40. 48, 76 Kraft paper/tissue paper or aluminium foil for voice coil Loudspeakers. 41. 48, 59 Lint free towels/paper Semiconductor devices, hybrid microcircuits. 42. 39, 73, 79, 85 Parts of magnetic sound heads Magnetic sound heads. 43. 39 Antistatic materials in the form of tubes, straps, bags, mats, covers, bins, boxes, containers Semiconductor devices, Hybrid Microcircuits. 44. 85 Anode assembly consisting of EHT cable, silicone rubber cap and contact spring or parts thereof Deflection components. LIST B 1. 38 Barium Titanate based ceramic compositions Ceramic Capacitors, silvered or unsilvered disc/dielectrics. 2. 37, 28, 29 (i) Photo resist and associated thinners or/and developers Semiconductor Devices, Printed Circuit Boards, Liquid Crystal Displays. (ii) Photospin Glass 3. 28, 29, 34 Resist Stripper Semiconductor Devices, Printed Circuit Boards. 4. 28, 29, 32, 38, 71 Resistive, Conductive, Di-electric, Overglaze or solder pastes, compositions or inks in packing not exceeding 20 kg Hybrid Microcircuits, Potentiometers, Ceramic and Mica Capacitors, Conductive Rubber Switches/Key-boards. 5. 32, 37, 39 Solder Mask/Resist in ink or film form, with or without associated catalysts Printed Circuit Boards. 6. 39, 85 Polyethylene terephthalate file with ferro magnetic coating of thickness upto 0.005 inch with magnetic coating 50 to 180 microinch Floppy diskettes. 7. 28 Silicon Monoxide Lumps Liquid Crystal Displays, metal film resistors. 8. 47 Bleached or unbleached Sulphide paper pulp or wood pulp Paper Cones for Loudspeakers. 9. 28, 32 (i) Ferric Oxide of purity of 99% Ferrites. (ii) Manganese Manganic Oxide of purity of 99% and above (iii) Manganese Dioxide of purity of 99% and above (iv) Manganous Oxide (v) Nickel Oxide (vi) Strontium Carbonate 10. 48 (i) Electrolytic Capa- citor/Condenser Tissue paper Electrolytic Capacitors, Plastic Film Capacitors. (ii) Plain/single or double Metallised Capacitor Tissue paper 11. 71 Silver alloy strips in coils of width upto 0.434 inches and thickness upto 0.006 inches Relays, connectors, switches, gas discharge tubes. 12. 15, 29, 32, 34, 39, 48, 70 (a) (i) Alpha cellulose paper/cotton paper (ii) Electrical grade craft paper (iii) Tung oil (iv) Volan/Silane treated glass fabric/cloth Copper clad laminates phenolic or paper Phenolic or glass epoxy types, printed circuit boards. (b) (i) Silane (ii) Glass filament yarn Silane treated glass cloth/fabric for use in the copper clad laminates. 13. 72, 73, 74, 76 (i) Iron of 99.7% purity and above Cast Alloy Permanent Magnets. (ii) Copper of 99.9% purity and above 14. 28, 38, 39, 70, 74, 76 (i) Aluminium paste (ii) Ethylene vinyl acetate sheets (EVA) Solar cells/modules. (iii) Primer for EVA (iv) Polyvinyl fluoride (TEDLAR) (v) Tedlar Aluminium Tedlar (vi) Crane glass (vii) Tedlar coated aluminium sheet (viii) Phosphorous Oxy- chloride (ix) Halo carbon (CF4)/Freon gas (x) Tinned copper interconnect (xi) Toughened glass with low iron content and transmissivity of minimum 90% and above (xii) Multilayered sheets with TEDLAR base (xiii) Fluro polymer resin (xiv) Ultra high purity (UHP) Silane in UHP Nitrogen (xv) UHP Silane (xvi) Diborane in UHP Silane (xvii) MOCVD grade phosphine in UHP silane (xviii) Silver speeltering Target (xix) High purity Tin tetra chloride (xx) Nitrogen Trifluoxide of 99% purity and above 15. 39, 69, 71, 76, 78, 85 (i) Aluminium wire with silicon or magnesium impurity of upto 2% Semiconductor devices. (ii) Gold wire with phosphorous or antimony doping (iii) Base solder (silver, lead, antimony based) (iv) Soft solder (lead, indium, silver based) (v) Gold tin alloy (vi) Preforms, discs, dots, rings, wafers, plates, repartitors of the following materials; (a) Aluminium silicon/silver coated or plated (b) Gold boron (c) Molybdenum (d) Lead-tin-solder (e) Silver antimony (f) Gold antimony (g) Silver Lead Indium (h) Silver Lead Antimony (i) Silver Lead Silicon An-timony (j) Solder (k) Lead Tin (l) Silver-Copper-Indium (m) Silver-Copper-Germanium Arsenic (n) Berrylium Oxide 16. 85 Insulated or enamelled copper wire of 45 SWG or finer than 45 SWG Deflection components, Coils and transformers. 17. 74, 85 (i) Oxygen-free high conductivity (OFHC) copper wires, bars, rods, angles, shapes and sections, plates, sheets, strips, tubes and pipes Semiconductor devices, electronic valves and tubes, transistor headers, glass to metal seals, capacitors (ii) Parts made of oxygen-free high conductivity copper 18. 74 Continuous cast electrolytic grade copper wire-rods of purity of 99.9% and above Electrodeposited copper foil for copper clad laminates 19. 73 Copper clad tin coated steel wire, dia 0.4 mm to 1.2 mm Lead tabs for electrolytic capacitors. 20. 39 Polyphenylene oxide (Flame retardant) resin Deflection components. 21. 76 Plain Aluminium Foil containing more than 99% Aluminium Etched or formed Aluminium Foil, Electrolytic capacitors or plastic film capacitors. 22. 70, 85 Fused Quartzware Semiconductor Devices, Silicon in all forms. 23. 32, 70, 85 (i) Glass frit or Glass Powder (ii) Glass preforms or pellets (iii) Glass tubes Liquid Crystal Displays, Semiconductor Devices, Electronic Valves and Tubes (other than television picture tubes/Cathode ray tubes), Glass to Metal Seals, Lead Frames, Transistor Headers, Reed Relays or Reed Switches, Delay Lines, Resistors (other than Heating Resistors), Mounted Piezoelectric Crystals, Electron guns and electron gun parts, Gas discharge tubes. 24. 39, 85 (i) Silicone rubber Keypad switches, parts of EHT transformers. (ii) Parts/articles of silicone, Elastomer or Silicone rubber Liquid Crystal Displays, Semiconductor Devices, EHT Transformers, Potentiometers, Electrolytic Capacitors, Solid tantalum capacitors. 25. 85 Pin connectors, including dip type, edge type and bellow type Semiconductor Devices, Liquid Crystal Displays, Hybrid Microcircuits. 26. 69, 78, 85 (i) Headers (ii) Caps with or without leads (iii) Cans with or without leads (iv) Pins (v) Stud seals (vi) Lead beads (vii) Ceramic beads (viii) Ceramic-glass packages (ix) Cap to Lead Assembles (x) Ceramic Pipes (xi) Lead frames, single or in roll form (xii) Housings (xiii) Brass ring Semiconductor devices, Resistors (other than Heating Resistors) Capacitors, Connectors, Hybrid Microcircuits, Printed components. 27. 85 Aluminium Leads Electrolytic Capacitors 28. 39, 48, 85 (i) Paper/Plastic cones (ii) Flat diaphragms Loudspeakers. 29. 85, 90 HT Cables X-ray Tubes. 30. 39, 74, 75, 76 Aluminium clad entry foil and back-up laminates Printed Circuit Boards. 31. 39, 85 (i) Polyolefins Tubes (ii) Etched Glass with or without Transducers Delay Lines. 32. 71 (i) Contact tape with pure Nickel base and Crown Gold alloy Relays, Switches. (ii) Contact tape with solder Diamond Back in fine silver (iii) Contact tape in silver or silver alloy with or without palladium with Gold overlay 33. 85 Testing Sockets Semiconductor Devices. 34. 38, 85 Silicon in the form of diffused wafers, discs or chips (with or without molybdenum disc) Hybrid microcircuit or semi-conductor devices. 35. 28, 38 Polycrystalline silicon Monocrystalline silicon, wafers, discs or chips for electronic applications. 36. 38, 85 (i) Tungsten coils (ii)Getters Electronic valves and tubes. 37. 40, 59 (i) Bungs (ii) Rubber pinch rollers with or without plastic bush Electrolytic capacitors, tape deck mechanisms. 38. 72, 73 Solder plated copper plated steel wires of dia 0.04 mm to 1.1 mm Capacitors, resistors (other than heating resistors), RF/IF coils, lead tabs. 39. 28, 34, 29, 48, 61, 68, 70, 82, 84, 85 (a) Mica and micualex washers (b) Abrasive powder (c) Parts of doping systems (d) Plastic film for wafer dicing Semiconductor devices, silicon (in all forms), Hybrid Microcircuits. (e) Sputter targets (f) Etch disc (g) Film template (h) Special gases (i) Hydrogen chloride (ii) 100% silane (iii) Ammonia (vi) Dichlorosilane (v) Argon (vi) Etch gas (vii) Hexaluroethane (viii) 5% phosphine in nitrogen (ix)Freon 14 (x) 15% phosphine in nitrogen (xi) Helium (xii)15% Arsene in -hydrogen (xiii) Boron trifluoride (xiv) Nitrogen in lacture bottles (xv) Sulphur hexafluoride 40. 28, 37, 38, 39, 71, 73 (i) Bismuth lead-Tin alloy (ii) Nickel plated steel strip (iii) Freon solvent TDA-5 (iv) Freon solvent TDA-55 (v) 3% Silane in nitrogen Semiconductor devices. (vi) Phosphane Silane in nitrogen (vii) Alkyd moulding com-pound (viii) Neutra clean 68/68D (ix) Freon TMSS (x) Pur-A-Masq (xi) Sodium hypophosphate (xii) Culmo-Starter (xiii) Culmo-Brightner (xiv) Culmo AN (xv) Culmo IRL (xvi) Freon solvent TDA - 35 (xvii) Freon solvent TF (xviii) Diborane in argon (xix) Tin - Silver Antimony alloy 41. 71 Gold in the form of wire, ribbon, preform of purity 99.99% and above Semi-conductor devices. 42. 37 Photo Polymer Film Printed Circuit Boards, Liquid Crystal Displays. 43. 28 Chromium di-oxide Magnetic Inks or Magnetic Tapes. 44. 28 (i) Silicon Tetrachloride Semiconductor Devices. (ii) Palladium Chloride 45. 81, 85 Bismuth-Cadmium alloys in all forms Semiconductor Devices. 46. 28 Barium Carbonate of purity of 98% and above Ceramic Capacitors, Elect-ronic valves and tubes, Gas discharge tubes. 47. 74 Berrylium Copper foil Magnetic Sound Heads. 48. 39 (i) Plain plastic films (other than Polystyrene film) of thickness 12 microns or below Plastic Film Capacitors, Mixed Dielectric Capacitors. (ii) Metallised plastic films of thickness 12 microns or below (iii) Plain Polystyrene film 49. 74 Electrolytic tough pitch (ETP) Copper wire and wire rods Lead wire for electronic components, capacitors. 50. 74 (i) Solder plated brass strips upto 100 mm width Potentiometers, connectors, switches, relays. (ii) Silver plated brass strips upto 100 mm width 51. 39 (i) (a) Nylon 6.30% glass filled, flame retardant moulding powder/granules and with or without other additives Potentiometers, connectors. (b) Plain and glass filled nylon/polyamide with or without other additives Relays, Potentiometers, tape deck mechanisms. (ii) Injection mouldable grade polyester moulding powder/compound with or without fillers or other additives Potentiometers. 52. 28, 29, 39, 71, 74,76 (i) Titanium dioxide of purity of 99% and above Piezoelectric elements, transducers, solar cells, solar modules. (ii) Reactive alumina super ground (iii) Neodymium oxide (iv) Liquidising binders (v) Aluminium powders of purity of 99% and above (vi) Aluminium foil (adhesive coated) for thermal bonding (vii) Copper band, silver plated/solder coated (viii) Furoic acid 53. 48, 59 (i) Silicone coated paper roll Cassettes, cassette parts. (ii) Pressure sensitive felt 54. 59 Felt sheet (fully compressed) of 1.5 mm thickness and below Tape deck mechanism. 55. 32, 35, 39, 40, 74, 76, 85 (i) Copper-cadmium braided wire (ii) Self-soldering/self-bon-ding aluminium wire Loudspeakers, microphones. 56. 39, 71, 74 (i) Gold plated twisted wire upto 0.4 mm dia Delay lines. (ii) Tin plated copper wire upto 0.4 mm dia (iii) Epoxy solder glue 57. 28, 38 Carbon powders, carbon black or carbon suspensions (like Corax L Sevacarb MT and AB carbon) in packings not exceeding 25 kg Potentiometers, magnetic tape. 58. 28, 38 Organic additives Electrodeposited copper foil for copper clad laminates. 59. 28, 29, 32, 38, 39, 71 (i) Polyvinyl butyral Potentiometers, ceramic capacitors. (ii) Xylok 225/Aralok 225 60. 29 Ethylene glycol monomethyl ether or its formulations Semiconductor devices. 61. 28,29, 35, 25, 38 (i) Hydroxy Propylmethyl Cellulose (ii) Aluminium oxide Ceramic capacitors, Ceramic substrates/rods. 62. 85 Parts of electron Guns Electron Gun Television picture tubes or Cathode Ray Tubes. 63. 28, 68 (i) Tantalum Neodyme oxide (ii) Neodyme oxide(iii) Strontium carbonate Ceramic Capacitors. 64. 29, 39 Ethane VG (Trichloro ethane) Deflection components. 65. 28, 31, 70, 74 (i) Suspension of Aluminium oxide in binder (ii) Suspension of Tungsten Powder and Alumiunium oxide in binder (iii) Tungsten Rhenium Wire (iv) Triple Carbonate suspension of calcium, barium, strontium in binder Electron guns and electron gun parts. 66. 81 Tantalum Powder Tantalum Capacitors. 67. 39 Silicone based resins, oils, varnishes, lacquers, elastomers, with or without additives Semiconductor Devices, Liquid Crystal Displays, Electronic Valves and Tubes, Resistors (other than Heating Resistors), Connectors, Magnetic Tape, Relays, Potentiometers, Switches, Capacitor grade metallised plastic film, Piezoelectric crystal, Hybrid Microcircuits. 68. 28, 29, 38, 39 (i) Epoxy/Epoxide resins, compounds or encapsulants (ii) Fillers, thinners, hardeners, accelerators and fire retardants Capacitors, Semiconductor Devices, Liquid Crystal Displays, Electronic Valves and Tubes, Switches, Copper clad laminates of glass epoxy/paper epoxy type, Delay lines, Line and Wave Traps,Potentiometers, Silicon Crystals or Silicon wafers, Connectors, Resistors (other than Heating Resistors), Deflection components Loudspeakers, Magnetic Heads, Paper Cones/Spiders/Dust Caps for Loudspeakers, Hybrid Microcircuits, Printed Components. 69. 39 Daillyl pathalate (DAP) moulding powder or compound, plain or glass filled with or without other additives Connectors, Switches, Potentiometers, Relays. 70. 75, 85, 90 Nickel and nickel alloys wrought in all forms and articles thereof Semiconductor Devices, Liquid Crystal Displays, Electronic valves and tubes, pick-up cartridges, Stylii, X-Ray Tubes, Cast Alloy Permanent magnets,Transistor Headers, Glass to metal seals, Lead frames, Resistors (other than Heating Resistors), Magnetic Heads, Potentiometers, Electron guns and electron gun parts, Electro-magnetic shields, Encoders and synchros. 71. 81, 85 Tantalum, wrought, in all forms and articles thereof Solid Tantalum Capacitors, Electronic Valves and Tubes. 72. 81, 85 Molybdenum and molybdenum alloys, wrought, in all forms and articles and parts thereof Electronic Valves and Tubes, X-Ray tubes, Semiconductor Devices, Mounted Piezoelectric Crystals. 73. 81, 85 Tungsten and tungsten alloys, wrought, in all forms and articles thereof Electronic valves and tubes, Semiconductor Devices. 74. 39, 40 Polyvinyl Alcohol, Polyisobutylene, Chlorosulphonated Polyethylene (HYPALON) Ferrites. 75. 74 Phosphor Bronze Sheets/ bars/sections/flats/strips/wire/rods/foils/pipes, with or without plating Relays, Tape Deck Mechanisms, Connectors, Potentiometers, Heat Sinks, cassettes, parts of cassettes, T.V. tuner, telescopic antenna, Gas discharge tubes. 76. 72, 73 (i) Kovar Alloys in all forms (ii) Nickel Iron Cobalt Alloy in all forms Semiconductor Devices, Electronic valves and tubes, Transistor Headers, Glass to Metal Seals, Lead Frames, Cast Alloy Permanent Magnets, Hybrid Microcircuits, Gas discharge tubes. 77. 80 Tin foil or Tin Alloy Foil Capacitors, Resistors (other than Heating Resistors). 78. 76 Aluminium of purity 99% or above in the form of wire, strips, sheets, rods, bars, pipes, plates, sections, ribbons or shapes Cans or Leads for Electrolytic Capacitors, Semiconductor Devices, Capacitors, Capacitor grade Metallised Plastic films, Potentiometers, Disc covers for electrolytic capacitors. 79. 39 Copolymerised Vinyl Chloride, Vinyl Acetate and Vinyl Alcohol Magnetic Tapes. 80. 81 Cobalt Cast Alloy Permanent Magnets. 81. 74 Beryllium Copper rods/ strips/sheets/wire/foils with or without plating Connectors, Relays, Switches, Gas discharge tubes. 82. 75 Nickel (unwrought) Cast alloy permanent magnets. 83. 79 Zinc wire of purity of 99.9% and above Plastic film capacitors, mixed dielectric capacitors. 84. 39 Double metallised plastic film Plastic film capacitors, mixed dielectric capacitors. 85. 39 Polypropylene moulding powder/granules Deflection components, Cassettes. 86. 39 Phenolic moulding powder/resin with or without fillers Potentiometers, Hybrid Microcircuits, cones, spiders and dust caps for loudspeakers. 87. 39 Polybutylene terephthalate Connectors, deflection components, switches, relays. 88. 39 Special purity nitrocellulose based binding solution Semiconductor devices. 89. 39, 40 (i) Polyphenelene sulphide (ii) Polyaryl sulphone Switches, connectors. 90. 39, 56 (i) Polyvinyl chloride film/sheet (ii) Non-woven cloth or liner (iii) Polyester liner (iv) PVC glue Floppy disks/diskettes, Floppy disk jacket, Head cleaning diskette. 91. 28, 38, 39, 75, 80 (i) Gold plating make up and replenisher solutions and salts (ii) Resins for gold recovery Semi Conductor Devices, Electronic valves and tubes, Connectors, Printed circuit boards, Glass to metal seals, lead frames, Headers. 92. 29 (i) Polyethylene Glycol (ii) Xylol (iii) Cyclohexanone Ferrites. 93. 35, 39 Polyamide coatings or adhesives Semiconductor devices, Heat sinks, deflection components. 94. 28, 39 Cellulose acetate/Cellulose triacetate foil or film in roll/Strip sheet Capacitors, semiconductor devices, mounted piezo-electric crystals, delay lines. 95. 39 Plain plastic film of thickness of 12 microns or below Electronic capacitor grade metallised dielectric plastic film. 96. 39 PTFE resin PTFE insulated wires and cables for electronic industry, Gas discharge tubes. 97. 28 Barium Chloride formulation of purity 98% and above in powder form Gas discharge tubes. 98. 71 Silver alloy wire of diameter upto 1 mm Gas discharge tubes. 99. 69 Ceramic plates/flats/cases/ bases/formers, steatite or alumina rods and bars, in uncoated or coated form Gas discharge tubes. 100. 29 (i) Acetone (ii) Propanol (Isopropyl alcohol) (iii) Monomethyl ether (iv) Triethylene amine (v) Dimethyl acetamide (vi) Trichloro trifluoro ethane (vii) Trichloro ethane (viii) Trichloro ethylene (ix) Paraformaldehyde Gas discharge tubes. 101. 32, 39 Epoxy based paints, inks, varnishes, lacquer or colour coding materials along with their thinners, removers, strippers Gas discharge tubes. 102. 28, 38, 39, 75, 80 (i) Nickel Sulphamate, nickel sulphate (ii) Nickel anode (iii) Ethyl acetate (iv) Silver cyanide Gas discharge tubes. 103. 72 Soft iron rods/bars/tubes upto 10 mm thickness with dimensional tolerance of +0.01 mm Gas discharge tubes. 104. 28, 39, 68, 70, 73, 81, 82 (i) Boron dopant (ii) Metallurgical grade silicon 98.5% purity and above (iii) Phosphorous dopant (iv) Aluminium oxide dressing sticks (v) Silicon carbide dressing sticks (vi) Silicon carbide abrasive powder (vii) Slow cure epoxy (viii) Graphite heater and graphite top/bottom (ix) Graphite zone parts other than in S. No. (viii) above (x) Quartz bell jar(xi) Quartz tube (xii) Fused quartz crucible (xiii) Tungsten rod (3mm dia) (xiv) Tungsten wire (0.3 mm dia) (xv) Molybdenum wire (xvi) Antimony dopant (xvii) ID saw blades (xviii) Steel wire for wire saw (xix) Roller for wire saw Undiffused silicon wafers. 105. 39, 48, 59 Drafting film (including cut and peel film) for master artwork preparation Printed Circuit Boards, Semiconductor Devices, Potentiometers, Hybrid Micro- circuits 106. 69, 39, 75, 28 (i) Evaporation Boats or Ceramic (including Boron Nitride) (ii) Diffusion Pump oil or fluid Capacitor Grade Metallised Plastic Films. 107. 28, 68 (i) Graphite Beams (ii) Graphite Heaters (iii) Graphite Hot Zones Parts (iv) Aluminium Oxide Dressing Stick (v) Silicon Carbide Dressing Stick Semiconductor Devices, Silicon (in all forms). 108. 48, 59, 84 (i) Denim Paper (ii) Filter Cartridges (iii) Filter elements Magnetic Tape, Printed Circuit Boards. 109. 85 (i) Parts of Rotor Assembly (ii) Commutator assembly or parts thereof (iii) Brush assembly or parts thereof DC Micromotors upto 13.5 volts and not exceeding 20 watts rating. 110. 74, 85 Rayon or Silk cover Litz wire in the following sizes, namely :- RF/IF Coils or transformers. (i) 24 (strands) x 0.03 mm (diameter of each strand) (ii) 12 (strands) x 0.03 mm (diameter of each strand) (iii) 9 (strands) x 0.04 mm (diameter of each strand) (iv) 6 (strands) x 0.04 mm (diameter of each strand) (v) 8 (strands) x 0.03 mm (diameter of each strand) (vi) 6 (strands) x 0.03 mm (diameter of each strand) 111. 74 Phosphor Bronze wire nettings (60 mesh and above) Cones, Spiders, Dust Caps for Loudspeakers. 112. 28, 29 (i) Electroless Nickel salts/ solutions (ii) Sodium Hypophosphite Glass to metal seals. 113. 69, 85 (i) Ceramic plates/Flats/cases bases/formers (ii) Steatite rods and bars in coated or uncoated form (iii) Alumina Rods and bars (with Alumina content above 90%) in coated or uncoated forms Resistors (other than Heating Resistors), Semiconductor Devices, Hybrid Microcircuits. 114. 28, 70, 73, 75, 85 (i) Crystal Holders, Bases, covers (ii) Glass Bulbs (iii) Glass Bases (iv) Nickel Eyelets (v) Springs (vi) Solder wire 25 SWG or thinner (vii) Chromium Pellets Mounted Piezoelectric crystals. 115. 39, 85 (i) Formers, Bases, Bobbins (ii) Holders, Brackets (iii) Shielding Cases, Cans RF/IF coils or Transformers or deflection components. 116. 28, 29, 32, 38, 39, 68, 74 (i) Copper plating salts, their brightners, levellers, conditioners, replenishers, stabilizers (ii) Alkaline etchant solution/salt (iii) Black Oxide Coating, (Microtech) solution/salts, predip solution/salts, palladium catalyst solution/salts (iv) Desmearing agents (v) Fluboric acid Printed Circuit Board. 117. 38, 68, 85 Graphite jigs/blocks/rods or plates Semiconductor devices, electronic valves and tubes, glass to metal seals, transistor headers and mono-crystalline silicon ingots/wafers. 118. 72 Stainless/heat resisting steel wires of size thinner than 0.31 mm dia (30 SWG) Potentiometers. 119. 74 Brass pipes/tubes of thickness of 0.2 mm to 0.3 mm (30 SWG) with OD of 2.5 mm to 13 mm Telescopic antennas. 120. 71, 85 Silfos wire/gate wire/tinned copper braided wire Semiconductor devices. 121. 83, 85 Tubular rivets of length upto 35 mm and inner diameter upto 1.5 mm Semiconductor devices. 122. 39, 59, 73 Screen mesh of stainless steel/polyester/metallised polyester or nylon (in sizes of mesh 60 or above) Potentiometers, ceramic capacitors. 123. 39 Polymide/polymide-amide tape, film or sheet Connectors, capacitors grade metallised plastic films. 124. 37, 39 (i) High resolution, high contrast photographic films and photo stencil films (ii) DIAZO(C 6 H 5 N 2 ) films (iii) Release film for multilayer laminates (iv) Dia Positive of screen drawing Printed circuit boards, semiconductor devices, hybrid microcircuits. 125. 39 Heat shrinkable PVC sleeving, tubing, film or ring Capacitors, relays, deflection components. 126. 39 Splicing tape Magnetic tape, cassettes. 127. 39, 48, 85 Insulating/taping material (including pocket carrier tape) in tape, roll or strip form with or without adhesive Capacitors, deflection components, resistors (other than heating resistors), semiconductor devices, inductors. 128. 27, 34, 39 (i) Silicon grease (ii) Cyanoacrylate or anaerobic sealants (iii) Molybdenum based lubricating compound (iv) Kilopoise lubricating grease Potentiometers, tape deck mechanisms, switches, relays, heat sinks, electronic valves and tubes. 129. 28, 29, 34, 38, 81, 85 (i) Glass to metal seals (ii) Lead-Tin alloy rings/tablets/sticks (iii) Colloidal graphite (iv) Collophan Tantalum capacitors. 130. 85 Casings of aluminium Electrolytic capacitors. 131. 69, 85 Clips including short clips Switches, relays, magnetic heads, mica capacitors. 132. 39 ABS moulding compounds/powder/resin with or without fillers Relays, switches, connectors, tape deck mechanisms, potentiometers, RF/IF Coils. 133. 28, 39, 68, 73 Lapping vehicles, Lapping pads, Lapping films, Lapping compounds (i) Diamond lapping paint (ii) Polyurethane lapping pads (iii) Blue steel lapping carriers (iv) Polyester based lapping film (v) Lapping/abrasive grains powders or compounds (including aluminium oxide, cerium oxide and silicon carbide powders, grains or compounds) Mounted piezoelectric crystals, printed circuit boards, semiconductor devices, potentiometers, resistors (other than heating resistors),connectors, switches, relays, tape deck mechanisms, magnetic heads, deflection components, DC Micromotors upto 13.5 volts and not exceeding 20 watts rating, silicon (in all forms). 134. 72 (i) CRNGO silicon steel strip with or without tin plating DC Micromotor, Potentiometer, Resistors. (ii) Coated/Uncoated/Elec-trogalvanised/CRCA/mild stainless steel in the form of sheet/strip/wire/coils DC Micromotor, Tape Deck Mechanism. 135. 25, 28, 40, 56, 70, 84, 85 (i) Potassium carbonate (ii) Strontiumcarbonate (iii) Barium carbonate Glass shell/parts of television picture tube. (iv) Sodium antiminate (v) Litharge (Led) (vi) Titanium dioxide (vii) Pumice powder (viii) Garnet powder (ix) Cerium oxide (x) Stud pins (xi) Anode buttons (xii) Necks and Neck tubings (xiii) Rubber sleeve (xiv) Wool felt (xv) Spodumene 136. 81 Metal alloy target Resistors (other than heating resistors) 137. 76 Etched Aluminium Foil Formed Aluminium Foil 138. 39 (i) Plain Polyester Film (ii) Polyurethane/Urethane Elastomer Magnetic Tape 139. 39 Methyl Ethyl Ketone Magnetic Tape 140. 85 Parts of CD-Deck Mechanism CD Deck Mechanism 141. 85 Parts of Flyback Transformer Flyback Transformers 142. 85 Parts of Tuners TV Tuners 143. 85 Parts of Data Cartridge Data Cartridge 144. 79 Zinc rods/wire of purity 99% or above Electronic Capacitor grade metallised plastic film 145. 39 Polypropylene granules Electronic capacitor grade plastic film of thickness upto 12 microns